When veteran engineer and executive Pat Gelsinger returned to Intel as CEO in 2021, the once-great chipmaker was in a slump. After failing to adapt to the mobile era and then missing several steps in cutting-edge microprocessor manufacturing, it was now also falling behind in supplying chips to feed the tech industry’s growing hunger for artificial intelligence. With optimism that at times seemed reckless, Gelsinger promised that Intel would make an epic comeback.
But the thing that everybody is giving us credit for is backside power, this new way of delivering power into the device, which gives you better current resistance performance, but it’s also improving the density of the chip. That means the same wafer, instead of producing 100 chips, can produce 120 chips. It’s a huge value proposition. You announced Microsoft as a customer of your foundry business. But Intel previously fell behind the competition in this market.
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