is scheduled to launch on July 12. Ahead of the launch event, the company just held a technology conference in the home country sharing its latest exploration and innovation results in the thin and light foldable form factor with the outside world.officially announced that it has developed the industry’s first 10% silicon content battery, which will be used to power the upcoming Honor Magic V3.
So, in this case, the increase in energy density means the battery of a given capacity will occupy relatively less internal volume. So Honor has been able to make the phone even thinner without sacrificing the battery capacity. Reportedly, the battery is 4.4% thinner than the predecessor. In addition to the high-density battery, Honor has also built the Honor E1 chip that optimizes power management. The chip reportedly maximizes energy efficiency to improve the battery life.
According to previous leaks and rumors, the Honor Magic V3 adopts a plain leather body. The camera module has also undergone tremendous changes. The phone is said to become both more capable and thinner than the, which was launched in July last year. For context, the Magic V2 is measured 9.9mm and 4.7mm thin while closed and opened respectively. The predecessor packs a 50MP main, 20MP 2.5x telephoto, and a 50MP ultrawide on the back and is powered by the Snapdragon 8 Gen 2 chipset.