) on April 1, said in a prepared statement. “With the anticipated growth of semiconductors in electronics, particularly in industrial and automotive, and the passage of the CHIPS and Science Act, there is no better time to further invest in our internal manufacturing capacity.”
According to the release, the fab will be designed to meet the LEED Gold standard of structural efficiency and sustainability. Its plans include recycling water at nearly double the rate of the existing Lehi fab. . According to TI, the first fab aims to produce tens of thousands of 300-millimeter wafer semiconductor chips a day by 2025.
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